The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Jul. 03, 2014
Qualcomm Incorporated, San Diego, CA (US);
Siamak Fazelpour, San Diego, CA (US);
Jiantao Zheng, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Sun Yun, San Diego, CA (US);
Rajneesh Kumar, San Diego, CA (US);
Houssam Wafic Jomaa, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A hybrid package having a processor module disposed on a substrate and an auxiliary module disposed on a patterned lid. The auxiliary module may be a memory module, a power management integrated circuit (PMIC) module, and/or other suitable module, that are located in the package along with the processor module. Having the auxiliary module in the package with the processor module reduces the noise at the solder bump between the processor module and the substrate. Having the auxiliary module in the package with the processor module also allows other modules to be added to the package without increasing the area of the package.