The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Feb. 13, 2017
Applicant:
Obsidian Sensors, Inc., La Jolla, CA (US);
Inventors:
Yaoling Pan, San Diego, CA (US);
Omar Bchir, San Marcos, CA (US);
Assignee:
OBSIDIAN SENSORS, INC., La Jolla, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/008 (2013.01); B81C 1/00214 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81C 2201/05 (2013.01); B81C 2203/0792 (2013.01); H01L 2924/1461 (2013.01);
Abstract
Conventional package for integration of MEMS and electronics suffer from profiles that are undesirably high to due to the thickness of the glass. Also in conventional package manufacturing, the MEMS and electronic devices are first individualized, and the individualized MEMS and electronics are combined into a package, and thus can be costly. To address these and other disadvantages, a panel level packaging is proposed. In this proposal, plural MEMS devices are integrated with plural semiconductor devices at a panel level, and the panel is then individualized into separate packages.