The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Apr. 29, 2015
Qualcomm Incorporated, San Diego, CA (US);
Chin-Kwan Kim, San Diego, CA (US);
Rajneesh Kumar, San Diego, CA (US);
Vladimir Noveski, San Diego, CA (US);
Jie Fu, San Diego, CA (US);
Ahmer Raza Syed, Chandler, AZ (US);
Milind Pravin Shah, San Diego, CA (US);
Omar James Bchir, San Marcos, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Some features pertain to a package that includes a redistribution portion, a first die coupled to the redistribution portion, a core layer coupled to the redistribution portion, and an encapsulation layer encapsulating the first die and the core layer. The redistribution portion includes a first dielectric layer. The core layer has a higher Young's Modulus than the encapsulation layer. In some implementations, the core layer includes a glass fiber (e.g., core layer is a glass reinforced dielectric layer). In some implementations, the core layer has a Young's Modulus of about at least 15 gigapascals (Gpa). In some implementations, the first die includes a front side and a back side, where the front side of the first die is coupled to the redistribution portion. In some implementations, the first dielectric layer is a photo imageable dielectric (PID) layer.