Chin-Kwan Kim

This inventor holds 36 USPTO granted patents and 15 published patent applications and 12 EPO patents, primarily in Antenna Packaging. Top assignee: Qualcomm Incorporated. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Kwan Kim. Retrieved from https://idiyas.com/inventor/chin-kwan-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 (Patent Applications = 15)

% Patents Active = 91.7

EPO Patents = 12 (Patent Applications = 19)

Average Co-Inventor Count = 3.9

ph-index = 8

Forward Citations = 167(Granted Patents)

Company Filing History:

36 out of 44,831

Qualcomm Incorporated

patents

Years Active: 2014-2025

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Areas of Expertise:

Integrated Circuit

Antenna Module

RFIC Packages

Electromagnetic Interference

Substrate Design

Millimeter Wave Antenna

Thermal Shielding

Embedded Components

Interconnects

Package-on-Package

Solder Joint Reliability

Die Embedded

36 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12354935 - Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods (2025-07-08),

2. 12300873 - Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods (2025-05-13),

3. 12293980 - Package comprising discrete antenna device (2025-05-06),

4. 12160952 - Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods (2024-12-03),

5. 11776888 - Package with a substrate comprising protruding pad interconnects (2023-10-03),

6. 11764489 - Sub-module L-shaped millimeter wave antenna-in-package (2023-09-19),

7. 11756894 - Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods (2023-09-12),

8. 11637057 - Uniform via pad structure having covered traces between partially covered pads (2023-04-25),

9. 11258165 - Asymmetric antenna structure (2022-02-22),

10. 11239573 - Sub-module L-shaped millimeter wave antenna-in-package (2022-02-01),

11. 11075260 - Substrate comprising recessed interconnects and a surface mounted passive component (2021-07-27),

12. 11043740 - Enhanced antenna module with shield layer (2021-06-22),

13. 10734332 - High aspect ratio interconnects in air gap of antenna package (2020-08-04),

14. 10510733 - Integrated device comprising embedded package on package (PoP) device (2019-12-17),

15. 10431511 - Power amplifier with RF structure (2019-10-01),

Title: Innovations of Chin-Kwan Kim in Antenna Technology

Introduction

Chin-Kwan Kim is a prominent inventor residing in San Diego, CA, known for his significant contributions to antenna technology. With an impressive portfolio of 35 patents, Kim has been instrumental in advancing methods and devices essential for modern radio-frequency communications.

Latest Patents

Among his latest innovations, Kim has developed antenna modules employing a package substrate that incorporates vertically-integrated patch antennas. These state-of-the-art modules feature a radio-frequency integrated circuit (RFIC) package, which supports RF communications through multiple RFICs. The package substrate contains several metallization layers with specialized metal interconnects, which facilitate signal routing between the RFICs and the antennas integrated within the substrate. His inventive approach allows for the patch antennas to be structured vertically, utilizing fabrication methods typically reserved for metal interconnects and vias. Additionally, another notable invention involves a package comprising a substrate and a discrete antenna device, which includes an EMI shield to enhance performance.

Career Highlights

Chin-Kwan Kim is currently associated with Qualcomm Incorporated, where he has played a crucial role in pioneering advancements in antenna technology. His extensive research and development efforts have positioned him as a leader in the field, contributing to the evolution of wireless communication systems.

Collaborations

Throughout his career, Kim has collaborated with talented individuals such as Omar James Bchir and Milind Shah. These partnerships have facilitated knowledge sharing and innovation, helping to push the boundaries of what is possible in antenna design and functionality.

Conclusion

Chin-Kwan Kim's contributions to antenna technology are a testament to his inventive spirit and dedication to advancing communication systems. His notable patents continue to pave the way for future innovations, reinforcing his status as a leading inventor in the technology sector. As he continues to refine and enhance his inventions, the impact of his work will undoubtedly resonate in the industry for years to come.

Profile summary based on public USPTO records.