The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Dec. 12, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jon Bradley Lasiter, Stockton, CA (US);

Ravindra Vaman Shenoy, Dublin, CA (US);

Donald William Kidwell, Jr., Los Gatos, CA (US);

Mohammad Ali Tassoudji, San Diego, CA (US);

Vladimir Aparin, San Diego, CA (US);

Seong Heon Jeong, San Diego, CA (US);

Jeremy Dunworth, La Jolla, CA (US);

Alireza Mohammadian, San Diego, CA (US);

Mario Francisco Velez, San Diego, CA (US);

Chin-Kwan Kim, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 21/50 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 21/10 (2006.01); H01Q 19/24 (2006.01); H01Q 9/16 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/50 (2013.01); H01L 23/3114 (2013.01); H01L 23/4985 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 19/24 (2013.01); H01Q 21/10 (2013.01); H01L 23/10 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01Q 9/16 (2013.01);
Abstract

In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.


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