This inventor holds 2 USPTO granted patents. Top assignee: Qualcomm Incorporated. Active years: 2017-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- San Diego, CA (US) (2017)
- Encinitas, CA (US) (2018)
Company Filing History:
Years Active: 2017-2018
Title: Vladimir Noveski: Innovator in Integrated Device Packaging
Introduction
Vladimir Noveski is a prominent inventor based in Encinitas, CA (US). He has made significant contributions to the field of integrated device packaging, holding a total of 2 patents. His work focuses on enhancing the reliability and efficiency of electronic devices through innovative packaging solutions.
Latest Patents
Noveski's latest patents include an integrated device package comprising a photo-sensitive fill between a substrate and a die. This invention features a die with a pillar, a substrate that includes a dielectric layer, and a conductive interconnect located within a non-conductive photosensitive fill. The design aims to improve the performance and reliability of electronic components.
Another notable patent is for a reinforced wafer-level package that includes a core layer designed to reduce stress in solder joints and improve their reliability. This package features a redistribution portion, a first die, and an encapsulation layer, with the core layer having a higher Young's Modulus than the encapsulation layer. This innovation is crucial for enhancing the durability of electronic devices.
Career Highlights
Vladimir Noveski is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work at Qualcomm has allowed him to push the boundaries of technology and contribute to advancements in integrated device packaging.
Collaborations
Throughout his career, Noveski has collaborated with notable colleagues, including Rajneesh Kumar and Milind Shah. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Vladimir Noveski is a key figure in the field of integrated device packaging, with a focus on improving the reliability and efficiency of electronic devices. His patents and work at Qualcomm demonstrate his commitment to innovation and excellence in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile