The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Oct. 30, 2013
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Chin-Kwan Kim, San Diego, CA (US);

Omar James Bchir, San Marcos, CA (US);

Dong Wook Kim, San Diego, CA (US);

Hong Bok We, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 25/0655 (2013.01); H05K 1/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15313 (2013.01);
Abstract

Some novel features pertain to a substrate that includes a first dielectric layer and a bridge structure. The bridge structure is embedded in the first dielectric layer. The bridge structure is configured to provide an electrical connection between a first die and a second die. The first and second dies are configured to be coupled to the substrate. The bridge structure includes a first set of interconnects and a second dielectric layer. The first set of interconnects is embedded in the first dielectric layer. In some implementations, the bridge structure further includes a second set of interconnects. In some implementations, the second dielectric layer is embedded in the first dielectric layer. The some implementations, the first dielectric layer includes the first set of interconnects of the bridge structure, a second set of interconnects in the bridge structure, and a set of pads in the bridge structure.


Find Patent Forward Citations

Quick Actions:

Kim, Chin-Kwan. (2017). Embedded bridge structure in a substrate (U.S. Patent No. 9642259). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9642259

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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