Dong Wook Kim

Title: Dong Wook Kim - Innovator in Semiconductor Packaging

Introduction

Dong Wook Kim is a prominent inventor based in San Diego, CA, recognized for his groundbreaking contributions in semiconductor packaging technology. With an impressive portfolio of 39 patents, he has made significant strides in enhancing the functionality and efficiency of electronic devices.

Latest Patents

Among his latest innovations are two notable patents that showcase his expertise:

1. **Bottom Package with Metal Post Interconnections** - This invention features a bottom package substrate designed with several metal posts that electrically connect through a die-side redistribution layer to multiple die interconnects. Critically, these metal posts and die interconnects are plated onto a seed layer on the substrate, allowing for improved electrical performance.

2. **High Density Fan Out Package Structure** - This patent describes a high-density fan out package structure that integrates a contact layer. This layer includes a conductive interconnect layer, presenting a first surface oriented toward an active die and a second surface facing a redistribution layer. The integration of a barrier layer on the first surface and conductive routing layers enhances the structure’s capabilities, facilitating connections between conductive interconnects and the active die.

Career Highlights

Dong Wook Kim has made significant contributions during his career, notably working at Qualcomm Incorporated, a leader in wireless technology and semiconductor innovation. His work at Qualcomm has helped propel advancements in the industry and reinforce the company's position as a key player in technology development.

Collaborations

Throughout his career, Kim has collaborated with talented individuals in the field, including esteemed colleagues like Hong Bok We and Kyu-Pyung Hwang. These partnerships have fostered creativity and innovation, leading to the successful development of advanced technologies in semiconductor packaging.

Conclusion

Dong Wook Kim's contributions to the field of semiconductor technology exemplify the spirit of innovation and the importance of collaboration in advancing electronic device functionality. With 39 patents to his name, he continues to shape the future of semiconductor packaging, influencing how electronic devices are designed and manufactured.