The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Mar. 04, 2014
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Hong Bok We, San Diego, CA (US);
Dong Wook Kim, San Diego, CA (US);
Jae Sik Lee, San Diego, CA (US);
Shiqun Gu, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 3/426 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 3/0094 (2013.01); H01L 2224/18 (2013.01);
Abstract
A substrate includes a plurality of vias that are lined with dielectric polymer having a substantially uniform thickness. This substantial uniform thickness provides a lumen within each dielectric-polymer-layer-lined via that is substantially centered within the via. Subsequent deposition of metal into the lumen for each dielectric-polymer-layer-lined via thus provides conductive vias having substantially centered metal conductors.