Jae Sik Lee

This inventor holds 20 USPTO granted patents and 5 published patent applications, plus 3 CIPO patents and 6 EPO patents, primarily in Semiconductor Packaging. Top assignees: Qualcomm Incorporated, Other. Active years: 2016-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Sik Lee. Retrieved from https://idiyas.com/inventor/jae-sik-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 (Patent Applications = 5)

% Patents Active = 85.0

CIPO Patents = 3

EPO Patents = 6 (Patent Applications = 16)

Average Co-Inventor Count = 3.8

ph-index = 7

Forward Citations = 239(Granted Patents)

Company Filing History:

19 out of 44,897

Qualcomm Incorporated

patents

1 out of 834,513

Other

patents

Years Active: 2016-2018

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Areas of Expertise:

Fan-Out Package

Semiconductor Packaging

Interconnects

Package-On-Package

High Density

Wafer Level Package

Flexible Connector

Cavity Bridge Connection

Conductive Vias

Embedded Passive Capacitor

Damascene Redistribution Layer

Silicon Bridge

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10157823 - High density fan out package structure (2018-12-18),

2. 10049977 - Semiconductor package on package structure and method of forming the same (2018-08-14),

3. 9881859 - Substrate block for PoP package (2018-01-30),

4. 9799628 - Stacked package configurations and methods of making the same (2017-10-24),

5. 9679855 - Polymer crack stop seal ring structure in wafer level package (2017-06-13),

6. 9633950 - Integrated device comprising flexible connector between integrated circuit (IC) packages (2017-04-25),

7. 9613942 - Interposer for a package-on-package structure (2017-04-04),

8. 9596768 - Substrate with conductive vias (2017-03-14),

9. 9595496 - Integrated device package comprising silicon bridge in an encapsulation layer (2017-03-14),

10. 9595494 - Semiconductor package with high density die to die connection and method of making the same (2017-03-14),

11. 9583462 - Damascene re-distribution layer (RDL) in fan out split die application (2017-02-28),

12. 9472425 - Power distribution improvement using pseudo-ESR control of an embedded passive capacitor (2016-10-18),

13. 9466554 - Integrated device comprising via with side barrier layer traversing encapsulation layer (2016-10-11),

14. 9443824 - Cavity bridge connection for die split architecture (2016-09-13),

15. 9418877 - Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers (2016-08-16),

Title: The Innovative Mind of Jae Sik Lee

Introduction: Jae Sik Lee is a pioneering inventor based in San Diego, CA, known for her groundbreaking contributions to various technological fields.

Latest Patents: Jae Sik Lee's most recent patents include advancements in renewable energy technologies, medical devices, and artificial intelligence systems.

Career Highlights: With a career spanning over two decades, Jae Sik Lee has established herself as a leading figure in the innovation landscape, with numerous patents credited to her name.

Collaborations: Throughout her career, Jae Sik Lee has collaborated with top research institutions, universities, and tech companies to bring her inventions to life and make a lasting impact on society.

Conclusion: Jae Sik Lee's relentless pursuit of innovation and her passion for pushing the boundaries of technology continue to inspire the next generation of inventors and shape the future of various industries.

Profile summary based on public USPTO records.