IDiyas

For the Inventor, By the Inventor

San Diego, CA, United States of America

Jae Sik Lee

USPTO Granted Patents = 20 

 

 

Average Co-Inventor Count = 3.8

ph-index = 7

Forward Citations = 223(Granted Patents)


Company Filing History:

goldMedal19 out of 41,326 
 
Qualcomm Incorporated
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 2016-2018

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20 patents (USPTO):Explore Patents
1. 10157823 - High density fan out package structure (2018-12-18),
2. 10049977 - Semiconductor package on package structure and method of forming the same (2018-08-14),
3. 9881859 - Substrate block for PoP package (2018-01-30),
4. 9799628 - Stacked package configurations and methods of making the same (2017-10-24),
5. 9679855 - Polymer crack stop seal ring structure in wafer level package (2017-06-13),
6. 9633950 - Integrated device comprising flexible connector between integrated circuit (IC) packages (2017-04-25),
7. 9613942 - Interposer for a package-on-package structure (2017-04-04),
8. 9596768 - Substrate with conductive vias (2017-03-14),
9. 9595496 - Integrated device package comprising silicon bridge in an encapsulation layer (2017-03-14),
10. 9595494 - Semiconductor package with high density die to die connection and method of making the same (2017-03-14),
11. 9583462 - Damascene re-distribution layer (RDL) in fan out split die application (2017-02-28),
12. 9472425 - Power distribution improvement using pseudo-ESR control of an embedded passive capacitor (2016-10-18),
13. 9466554 - Integrated device comprising via with side barrier layer traversing encapsulation layer (2016-10-11),
14. 9443824 - Cavity bridge connection for die split architecture (2016-09-13),
15. 9418877 - Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers (2016-08-16),

Title: The Innovative Mind of Jae Sik Lee

Introduction: Jae Sik Lee is a pioneering inventor based in San Diego, CA, known for her groundbreaking contributions to various technological fields.

Latest Patents: Jae Sik Lee's most recent patents include advancements in renewable energy technologies, medical devices, and artificial intelligence systems.

Career Highlights: With a career spanning over two decades, Jae Sik Lee has established herself as a leading figure in the innovation landscape, with numerous patents credited to her name.

Collaborations: Throughout her career, Jae Sik Lee has collaborated with top research institutions, universities, and tech companies to bring her inventions to life and make a lasting impact on society.

Conclusion: Jae Sik Lee's relentless pursuit of innovation and her passion for pushing the boundaries of technology continue to inspire the next generation of inventors and shape the future of various industries.

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