The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Jun. 08, 2015
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/50 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/147 (2013.01); H01L 23/3107 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/50 (2013.01); H01L 24/00 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2225/06548 (2013.01);
Abstract
A package-on-package (PoP) structure includes a first die, a second die, and a memory device electrically coupled to the first die and the second die by an interposer between the first die and the second die. The interposer includes copper-filled vias formed within a mold.