The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Apr. 09, 2014
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Hong Bok We, San Diego, CA (US);
Dong Wook Kim, San Diego, CA (US);
Kyu-Pyung Hwang, San Diego, CA (US);
Young Kyu Song, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H03K 3/013 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); G05F 3/08 (2006.01); H05K 3/30 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H03K 3/013 (2013.01); G05F 3/08 (2013.01); H01L 23/49822 (2013.01); H01L 23/50 (2013.01); H05K 1/0306 (2013.01); H05K 1/183 (2013.01); H05K 1/184 (2013.01); H05K 3/306 (2013.01); H05K 3/4697 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10015 (2013.01); Y10T 29/49139 (2015.01);
Abstract
An embedded multi-terminal capacitor embedded in a substrate cavity includes at least one metal layer patterned into a plurality of power rails and a plurality of ground rails. The substrate includes an external power network.