The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Apr. 28, 2022
Applicant:
Rockley Photonics Limited, Altrincham, GB;
Inventors:
Gerald Cois Byrd, Shadow Hills, CA (US);
Thomas Pierre Schrans, Temple City, CA (US);
Chia-Te Chou, Brea, CA (US);
Arin Abed, Glendale, CA (US);
Omar James Bchir, San Marcos, CA (US);
Erman Timurdogan, Arlington, MA (US);
Aaron John Zilkie, Pasadena, CA (US);
Assignee:
Rockley Photonics Limited, Altrincham, GB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 77/00 (2025.01); G02B 6/42 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H10F 77/953 (2025.01); G02B 6/428 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/53233 (2013.01); H05K 1/0209 (2013.01); H10F 77/933 (2025.01); G02B 6/4269 (2013.01); H01L 2224/48091 (2013.01);
Abstract
An optoelectronic module. In some embodiments, the optoelectronic module includes a substrate; a digital integrated circuit, on an upper surface of the substrate; a photonic integrated circuit, secured in a pocket of the substrate, the pocket being in the upper surface of the substrate; and an analog integrated circuit, on the photonic integrated circuit.