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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10199152 B1

PDFFull Text
Date of Patent:
Feb. 05, 2019

Filed:

Jun. 18, 2015

Embedded thin film magnetic carrier for integrated voltage regulator

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Mete Erturk, San Diego, CA (US);

Ravindra Vaman Shenoy, Dublin, CA (US);

Kwan-yu Lai, Campbell, CA (US);

Jitae Kim, Mountain View, CA (US);

Donald William Kidwell, Jr., Campbell, CA (US);

Jon Bradley Lasiter, Stockton, CA (US);

James Thomas Doyle, Carlsbad, CA (US);

Omar James Bchir, San Marcos, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Tuyen Nguyen

Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 1/147 (2006.01); H01F 27/24 (2006.01); H01F 41/02 (2006.01); H01F 41/14 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H05K 1/16 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 1/14708 (2013.01); H01F 5/00 (2013.01); H01F 17/0033 (2013.01); H01F 27/24 (2013.01); H01F 41/02 (2013.01); H01F 41/046 (2013.01); H01F 41/14 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H05K 1/111 (2013.01); H05K 1/165 (2013.01); H05K 1/182 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0066 (2013.01); H01F 2027/2809 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H05K 2201/10166 (2013.01);
Abstract

An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

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