The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Apr. 19, 2023
Qualcomm Incorporated, San Diego, CA (US);
Michelle Yejin Kim, Carlsbad, CA (US);
Hong Bok We, San Diego, CA (US);
Joan Rey Villarba Buot, Escondido, CA (US);
Kuiwon Kang, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
A substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength. In one aspect, a substrate comprises a core layer. The core layer comprises a metal core, the metal core having a first surface and a second surface opposite the first surface. The core layer further comprises a first insulation layer on the first surface and a second insulation layer on the second surface. The substrate further comprises a first metallization structure adjacent to the first insulation layer and a second metallization structure adjacent to the second insulation layer. The metal core provides electrical shielding of signals/power routed through the metal core for noise coupling reduction allowing a higher density of signal and power paths to be supported in substrate, while also strengthening structural integrity to prevent or reduce warpage in the IC package.