The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

May. 01, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Seongryul Choi, Seongnam, KR;

Kuiwon Kang, San Diego, CA (US);

Jung Won Park, Gumi, KR;

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/185 (2026.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H05K 1/115 (2013.01); H05K 3/32 (2013.01); H05K 3/4053 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10015 (2013.01);
Abstract

In an aspect, an electronic device is disclosed that includes a core having an upper planar surface and an interior planar surface; a cavity extending at least partially through the upper planar surface of the core to the interior planar surface of the core; an electronic component mounted in the cavity, the electronic component including an upper planar surface having one or more electronic component terminals, wherein the electronic component is supported by the interior planar surface of the core so that the upper planar surface of the electronic component is level with the upper planar surface of the core; and an upper metallization structure configured to provide one or more conductive paths from the one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.


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