The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Sep. 14, 2021
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Hong Bok We, San Diego, CA (US);

Joan Rey Villarba Buot, Escondido, CA (US);

Aniket Patil, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/42 (2006.01); H01Q 1/52 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/422 (2013.01); H01Q 1/526 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/065 (2013.01);
Abstract

Multi-sided antenna modules employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related antenna module fabrication methods. The multi-sided antenna module includes an integrated circuit (IC) die(s) disposed on a first side of the package substrate. The multi-sided antenna module further includes first and second substrate antenna layers disposed on respective first and second sides of the package substrate. The first substrate antenna layer includes a first antenna(s) disposed on the first side of the package substrate adjacent to the IC die(s). The second substrate antenna layer includes a second antenna(s) disposed on the second side of the package substrate opposite of the first side of the package substrate. In this manner, the multi-sided antenna module, including antennas on multiple sides of the package substrate, provides antenna coverage that extends from both sides of the package substrate to provide multiple directions of coverage.


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