The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Sep. 17, 2020
Applicant:

Dyi-chung HU, Hsinchu, TW;

Inventor:

Dyi-Chung Hu, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); B23K 1/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53242 (2013.01); B23K 1/00 (2013.01); H01L 21/4853 (2013.01); H01L 23/53228 (2013.01); H01L 24/14 (2013.01); H01L 2021/60135 (2013.01);
Abstract

An integrated substrate structure includes a redistribution film, a circuit substrate, and a plurality of conductive features. The redistribution film includes a fine redistribution circuitry, a circuit substrate is disposed over the redistribution film and includes a core layer and a coarse redistribution circuitry disposed in and on the core layer. The circuit substrate is thicker and more rigid than the redistribution film, and a layout density of the fine redistribution circuitry is denser than that of the coarse redistribution circuitry. The conductive features are interposed between the circuit substrate and the redistribution film to be connected to the fine redistribution circuitry and the coarse redistribution circuitry. A redistribution structure and manufacturing methods are also provided.


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