The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Nov. 04, 2022
Applicant:
Dyi-chung HU, Hsinchu, TW;
Inventor:
Dyi-Chung Hu, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/49894 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01);
Abstract
A semiconductor substrate structure includes a first group of circuit structure and a second group of circuit structure. The first group of circuit structure includes multiple first circuit layers and a first bonding layer. The second group of circuit structure includes multiple second circuit layers and a second bonding layer. The second group of circuit structure is disposed on the first group of circuit structure and is electrically connected to the first group of circuit structure. The first bonding layer is bonded to the second bonding layer to form a multilayer redistribution structure. A manufacturing method of the semiconductor substrate structure is also provided.