For the Inventor, By the Inventor

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Hsinchu, Taiwan

Advanced Chip Engineering Technology, Inc.

USPTO Granted Patents = 37

% Expired Patents = 16.2

Forward Citations = 596

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28 inventors (with patents filed for the assignee):

Wen-Kun Yang (32 out of 47 patents)

Jui-Hsien Chang (10 out of 15 patents)

Wen-Pin Yang (5 out of 8 patents)

4. Wen-Bin Sun (5 out of 5 patents)

5. Chao-Nan Chou (4 out of 4 patents)

6. Chih-Wei Lin (3 out of 11 patents)

7. Wen Kun Yang (3 out of 4 patents)

8. Chun-Hui Yu (3 out of 4 patents)

9. Chihwei Lin (3 out of 3 patents)

10. Diann-Fang Lin (3 out of 5 patents)

11. Hsien-Wen Hsu (3 out of 3 patents)

12. Shih-Li Chen (3 out of 6 patents)

13. Tung-Chuan Wang (3 out of 4 patents)

14. Chin-Chen Yang (3 out of 5 patents)

15. His-Ying Yuan (3 out of 3 patents)

37 patents: Sort by Forward Citations

1. 8178964 - Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same (2012-05-15),

2. 8178963 - Wafer level package with die receiving through-hole and method of the same (2012-05-15),

3. 8058102 - Package structure and manufacturing method thereof (2011-11-15),

4. 7985626 - Manufacturing tool for wafer level package and method of placing dies (2011-07-26),

5. 7911044 - RF module package for releasing stress (2011-03-22),

6. 7863105 - Image sensor package and forming method of the same (2011-01-04),

7. 7812434 - Wafer level package with die receiving through-hole and method of the same (2010-10-12),

8. 7763494 - Semiconductor device package with multi-chips and method of the same (2010-07-27),

9. 7687923 - Semiconductor device package having a back side protective scheme (2010-03-30),

10. 7667318 - Fan out type wafer level package structure and method of the same (2010-02-23),

11. 7655501 - Wafer level package with good CTE performance (2010-02-02),

12. 7566854 - Image sensor module (2009-07-28),

13. 7557437 - Fan out type wafer level package structure and method of the same (2009-07-07),

14. 7534632 - Method for circuits inspection and method of the same (2009-05-19),

15. 7525185 - Semiconductor device package having multi-chips with side-by-side configuration and method of the same (2009-04-28),

Advanced Chip Engineering Technology, Inc. is a leading semiconductor company specializing in the design and manufacture of advanced microchips for various industries. With a team of highly skilled engineers and state-of-the-art facilities, we deliver cutting-edge solutions that power next-gen devices. Our expertise spans across multiple areas, including integrated circuits, system-on-a-chip (SoC) design, embedded systems, and more. Visit our website to learn more about our innovative technologies and how we can help transform the future of your business.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

37 Patents

#115 in Hsinchu

#512 in Taiwan

#18,222 in the World

Hsinchu, Taiwan

Advanced Chip Engineering Technology, Inc.

Forward Citations = 596

28 inventors:

Wen-Kun Yang (32 out of 47 patents)

Jui-Hsien Chang (10 out of 15 patents)

Wen-Pin Yang (5 out of 8 patents)

4. Wen-Bin Sun (5 out of 5 patents)

5. Chao-Nan Chou (4 out of 4 patents)

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