The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
Jun. 18, 2008
Wen-kun Yang, Hsin-Chu, TW;
Tung-chuan Wang, Taoyuan County, TW;
Chao-nan Chou, Taipei, TW;
Chih-wei Lin, Gueiren Township, Tainan County, TW;
Wen-Kun Yang, Hsin-Chu, TW;
Tung-Chuan Wang, Taoyuan County, TW;
Chao-Nan Chou, Taipei, TW;
Chih-Wei Lin, Gueiren Township, Tainan County, TW;
Advanced Chip Engineering Technology Inc., Hsinchu County, TW;
Abstract
The present invention provides a structure of package comprising a substrate with a pre-formed die receiving cavity formed and/or terminal contact metal pads formed within an upper surface of the substrate. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. At least one re-distribution built up layer (RDL) is formed on the dielectric layer and coupled to the die via contact pad. Connecting structure, for example, UBM is formed over the re-distribution built up layer. Terminal Conductive bumps are coupled to the UBM.