Tung-Chuan Wang

Title: Innovations of Tung-Chuan Wang

Introduction

Tung-Chuan Wang is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of four patents. His work focuses on enhancing the performance and efficiency of semiconductor devices.

Latest Patents

Wang's latest patents include a "Wafer level package with good CTE performance." This invention provides a structure of a package that comprises a substrate with a pre-formed die receiving cavity and terminal contact metal pads on the upper surface. A die is adhered within the cavity, and a dielectric layer is formed on both the die and the substrate. Additionally, at least one re-distribution built-up layer (RDL) is coupled to the die via a contact pad, with terminal conductive bumps connected to the UBM.

Another significant patent is the "Semiconductor device package having multi-chips with side-by-side configuration." This invention features a substrate with die receiving through holes and connecting through holes structure. It includes first and second contact pads on the upper and lower surfaces of the substrate. The design allows for the placement of two dies within the through holes, with bonding wires coupling the dies to the contact pads. A dielectric layer is formed over the bonding wires, and a build-up layer is created on the lower surface of the substrate.

Career Highlights

Wang has worked with Advanced Chip Engineering Technology