The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Mar. 15, 2007
Wen-kun Yang, Hsin-Chu, TW;
Diann-fang Lin, Hukou Township, Hsinchu County, TW;
Jui-hsien Chang, Jhudong Township, Hsinchu County, TW;
Tung-chuan Wang, Yangmei Town, TW;
Wen-Kun Yang, Hsin-Chu, TW;
Diann-Fang Lin, Hukou Township, Hsinchu County, TW;
Jui-Hsien Chang, Jhudong Township, Hsinchu County, TW;
Tung-Chuan Wang, Yangmei Town, TW;
Abstract
The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.