Diann-Fang Lin

Title: Diann-Fang Lin: Innovator in Semiconductor Device Packaging

Introduction

Diann-Fang Lin is a prominent inventor based in Hukou, Taiwan. She has made significant contributions to the field of semiconductor device packaging, holding a total of five patents. Her innovative work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Diann-Fang Lin's latest patents include a groundbreaking package structure that utilizes redistribution layer (RDL) and through silicon via (TSV) techniques. This invention discloses a semiconductor device package structure that comprises an electronic element featuring a dielectric layer on its backside surface. It includes a plurality of first conductive through vias that traverse the electronic element and the dielectric layer, along with conductive pads that accompany these vias on the active surface of the electronic element. Additionally, the package structure incorporates a filler material adjacent to the electronic element, a first redistribution layer connected to the first conductive through vias, and protective layers that safeguard the electronic components.

Career Highlights

Throughout her career, Diann-Fang Lin has worked with notable companies such as Advanced Chip Engineering Technology, Inc. Her experience in these organizations has allowed her to refine her skills and contribute to advancements in semiconductor technology.

Collaborations

Diann-Fang Lin has collaborated with esteemed colleagues, including Wen-Kun Yang and Tung-Chuan Wang. These partnerships have fostered innovation and have been instrumental in her research and development efforts.

Conclusion

Diann-Fang Lin is a trailblazer in the semiconductor industry, with her patents reflecting her commitment to innovation and excellence. Her work continues to influence the development of advanced semiconductor packaging solutions.