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Wen-Kun Yang

This inventor holds 47 USPTO granted patents and 1 published patent application, primarily in Wafer Level Packaging. Top assignees: Advanced Chip Engineering Technology, Inc., King Dragon International Inc., Adavanced Chip Engineering Technology Inc.. Active years: 2002-2013.

USPTO Granted Patents = 47 (Patent Applications = 1)

% Patents Active = 83.0

Average Co-Inventor Count = 1.8

ph-index = 15

Forward Citations = 702(Granted Patents)

Location History:

Hsinchu City, TW (2002 - 2003)
Hsinchu, TW (2004 - 2013)

Company Filing History:

32 out of 37

Advanced Chip Engineering Technology, Inc.

patents

7 out of 9

King Dragon International Inc.

patents

1 out of 1

Adavanced Chip Engineering Technology Inc.

patent

4. 7 out of 834,350

Other

patents

Years Active: 2002-2013

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Areas of Expertise:

Wafer Level Package

Semiconductor Device

Image Sensor Module

Chip Stacking

Thermal Management

Through Silicon Via

Dual Build-Up Layers

Fan Out Type Package

Multi-Chip Packaging

CTE Performance

Embedded Die

Protection Layer

47 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8350377 - Semiconductor device package structure and method for the same (2013-01-08),

2. 8304287 - Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same (2012-11-06),

3. 8299488 - LED chip (2012-10-30),

4. 8237257 - Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same (2012-08-07),

5. 8236608 - Stacking package structure with chip embedded inside and die having through silicon via and method of the same (2012-08-07),

6. 8232633 - Image sensor package with dual substrates and the method of the same (2012-07-31),

7. 8178964 - Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same (2012-05-15),

8. 8178963 - Wafer level package with die receiving through-hole and method of the same (2012-05-15),

9. 8115297 - Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same (2012-02-14),

10. 8106504 - Stacking package structure with chip embedded inside and die having through silicon via and method of the same (2012-01-31),

11. 7985626 - Manufacturing tool for wafer level package and method of placing dies (2011-07-26),

12. 7911044 - RF module package for releasing stress (2011-03-22),

13. 7863105 - Image sensor package and forming method of the same (2011-01-04),

14. 7812434 - Wafer level package with die receiving through-hole and method of the same (2010-10-12),

15. 7763494 - Semiconductor device package with multi-chips and method of the same (2010-07-27),

Title: Inventor Wen-Kun Yang: Pioneering Innovations in Hsin-Chu

Introduction: Wen-Kun Yang is a visionary inventor based in Hsin-Chu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Wen-Kun Yang holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials. Her recent patents focus on enhancing the efficiency of solar cells and developing sustainable energy solutions.

Career Highlights: With a background in engineering and a passion for sustainable development, Wen-Kun Yang has led numerous research projects that have resulted in significant technological advancements. Her work has been instrumental in shaping the future of clean energy and environmental conservation.

Collaborations: Throughout her career, Wen-Kun Yang has collaborated with leading research institutions, universities, and technology companies to further her research and bring her innovative ideas to life. Her collaborative efforts have led to the successful implementation of cutting-edge technologies in various industries.

Conclusion: Inventor Wen-Kun Yang's dedication to innovation and sustainability has positioned her as a key figure in the field of technology. Her pioneering work continues to inspire future generations of inventors and researchers to push the boundaries of what is possible in the world of science and technology.

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