The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Mar. 30, 2007
Applicant:
Wen-kun Yang, Hsin-Chu, TW;
Inventor:
Wen-Kun Yang, Hsin-Chu, TW;
Assignee:
Advanced Chip Engineering Technology, Inc., Hsinchu County, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
A structure of a semiconductor device package having a substrate with a die receiving through hole, a connecting through hole structure and a contact pad. A die is disposed within the die receiving through hole. A surrounding material is formed under the die and filled in the gap between the die and the sidewall of the die receiving though hole. Dielectric layers are formed on the both side surface of the die and the substrate. Re-distribution layers (RDL) are formed on the dielectric layers and coupled to the contact pads. Protection layers are formed over the RDLs.