Chao-Nan Chou

Title: Innovations of Chao-Nan Chou

Introduction

Chao-Nan Chou is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Chou's latest patents include a "Wafer level package with good CTE performance." This invention provides a structure of a package that comprises a substrate with a pre-formed die receiving cavity and terminal contact metal pads formed within the upper surface of the substrate. A die is disposed within the die receiving cavity by adhesion, and a dielectric layer is formed on both the die and the substrate. At least one re-distribution built-up layer (RDL) is formed on the dielectric layer and coupled to the die via a contact pad. A connecting structure, such as UBM, is formed over the re-distribution built-up layer, with terminal conductive bumps coupled to the UBM. Another notable patent is for an "Image sensor with a protection layer." This invention features an image sensor die that comprises a substrate and an image sensor array formed over the substrate. Micro lenses are disposed on the image sensor array, and a protection layer is formed on the micro lenses to prevent particle contamination.

Career Highlights

Chao-Nan Chou is currently employed at Advanced Chip Engineering Technology, Inc. His work at this company has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Chou has collaborated with notable coworkers, including Wen-Kun Yang and Chih-Wei Lin. Their combined expertise has fostered innovation and development in their projects.

Conclusion

Chao-Nan Chou's contributions to semiconductor packaging and image sensor technology highlight his role as a leading inventor in the field. His patents reflect a commitment to improving electronic component performance and reliability.