The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Aug. 16, 2004
Applicants:
Wen-kun Yang, Hsin-Chu, TW;
Shih-li Chen, Hsin-Chu, TW;
Wen-bin Sun, Taipei, TW;
Ming-hui Lin, Miao-Li, TW;
Chao-nan Chou, Taipei, TW;
Chih-wei Lin, Tainan, TW;
Inventors:
Wen-Kun Yang, Hsin-Chu, TW;
Shih-Li Chen, Hsin-Chu, TW;
Wen-Bin Sun, Taipei, TW;
Ming-Hui Lin, Miao-Li, TW;
Chao-Nan Chou, Taipei, TW;
Chih-Wei Lin, Tainan, TW;
Assignee:
Advanced Chip Engineering Technology Inc., Hsinchu Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.