Chun-Hui Yu

Title: The Innovations of Chun-Hui Yu

Introduction

Chun-Hui Yu is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of technology, particularly in the area of packaging for electronic components. With a total of 4 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is for an RF module package designed to release stress. This invention features a structure that includes a substrate with a die receiving through hole, a base attached to the substrate, and a die positioned within the hole. The design also incorporates a dielectric layer, a re-distribution layer (RDL), and a protection layer, with pads formed on the protection layer. The RDL is made from an alloy that includes Ti/Cu/Au or Ti/Cu/Ni/Au. Another significant patent is for a system-in-package and its manufacturing method. This invention also includes a substrate with a die receiving through hole, a surrounding material, and a re-distribution layer, along with a protection layer and terminal contact pad.

Career Highlights

Chun-Hui Yu has worked with several companies throughout his career, including Advanced Chip Engineering Technology, Inc. and Advanced Clip Engineering Technology Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects.

Collaborations

He has collaborated with notable coworkers such as Wen-Kun Yang and Chao-Nan Chou, further enhancing his work in the field.

Conclusion

Chun-Hui Yu's contributions to technology through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to shape the future of electronic packaging.