The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Dec. 30, 2004
Wen-kun Yang, Hsin-Chu, TW;
Chin-chen Yang, Taipei, TW;
Cheng-hsien Chiu, Kaohsing, TW;
Wen-bin Sun, Taipei, TW;
Kuang-chi Chao, Kaohsiung, TW;
His-ying Yuan, Taoyuan, TW;
Chun-hui Yu, Tainan, TW;
Wen-Kun Yang, Hsin-Chu, TW;
Chin-Chen Yang, Taipei, TW;
Cheng-hsien Chiu, Kaohsing, TW;
Wen-Bin Sun, Taipei, TW;
Kuang-Chi Chao, Kaohsiung, TW;
His-Ying Yuan, Taoyuan, TW;
Chun-Hui Yu, Tainan, TW;
Advanced Chip Engineering Tachnology Inc., Hsinchu County, TW;
Abstract
A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.