The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Jun. 30, 2008
Dyi-chung HU, Chutung Township, Hsinchu County, TW;
Chun-hui Yu, Tainan, TW;
Dyi-Chung Hu, Chutung Township, Hsinchu County, TW;
Chun-Hui Yu, Tainan, TW;
Advanced Clip Engineering Technology Inc., Hukou Township, Hsinchu County 303, TW;
Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole and a contact conductive via formed therein, a die disposed within the die receiving through hole, a surrounding material filled in the gap except the die area of the die receiving though hole, a re-distribution layer formed on the substrate and coupled to the contact conductive via, a protection layer formed over the re-distribution layer, a cover material formed over the protection layer; and a terminal contact pad formed on the lower surface of the substrate and under the contact conductive via and the die to couple the contact conductive via.