Company Filing History:
Years Active: 2007-2011
Title: Chihwei Lin: Innovator in Semiconductor Technology
Introduction
Chihwei Lin is a prominent inventor based in Gueiren, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative packaging solutions that enhance the performance and reliability of semiconductor devices.
Latest Patents
One of Chihwei Lin's latest patents is the "RF module package for releasing stress." This invention discloses a package structure that includes a substrate with a die receiving through hole, a base attached to the substrate, and a dielectric layer formed on the die and substrate. The re-distribution layer (RDL) is made from an alloy comprising Ti/Cu/Au or Ti/Cu/Ni/Au, which helps in managing stress within the module.
Another notable patent is the "Semiconductor device protective structure and method for fabricating the same." This invention provides a protective structure for semiconductor devices, featuring a die with contact metal balls that electrically couple with a printed circuit board. The design includes a first buffer layer on the substrate and a second buffer layer that encompasses the substrate, reducing the risk of damage from external impacts.
Career Highlights
Chihwei Lin is currently employed at Advanced Chip Engineering Technology, Inc., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the reliability and efficiency of semiconductor devices.
Collaborations
Chihwei has collaborated with notable colleagues such as Wen-Kun Yang and Kuang-Chi Chao, contributing to various projects that enhance semiconductor technology.
Conclusion
Chihwei Lin's contributions to semiconductor technology through his innovative patents and collaborative efforts highlight his role as a key inventor in the field. His work continues to influence the development of advanced semiconductor solutions.