The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Nov. 28, 2007
Applicants:
Wen-kun Yang, Hsinchu, TW;
Wen-pin Yang, Hsinchu, TW;
Shih-li Chen, Jhudong Township, Hsinchu County, TW;
Inventors:
Wen-Kun Yang, Hsinchu, TW;
Wen-Pin Yang, Hsinchu, TW;
Shih-Li Chen, Jhudong Township, Hsinchu County, TW;
Assignee:
Advanced Chip Engineering Technology Inc., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.