Hsinchu, Taiwan

Wen Kun Yang

USPTO Granted Patents = 4 

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 127(Granted Patents)


Company Filing History:


Years Active: 2007-2016

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4 patents (USPTO):

Title: Innovations of Wen Kun Yang

Introduction

Wen Kun Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Wen Kun Yang's latest patents include a semiconductor device package and a method of the same. This invention proposes a semiconductor device package structure that comprises a substrate, an adhesive layer, and a die. The substrate features electrical through-holes to interconnect a first and second wiring circuit on the top and bottom surfaces, respectively. A contact conductive bump is formed on the first wiring circuit, while the under-fill adhesive layer is applied to the top surface and the first wiring circuit of the substrate, excluding the area of the die. The die is equipped with a bump structure on its bonding pads, which is electrically connected to the contact conductive bump of the substrate's first wiring circuit.

Another significant patent is the structure of an image sensor module and a method for manufacturing a wafer-level package. This invention discloses an image sensor module that includes a metal alloy base, a wafer-level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer-level package, which contains multiple image sensor dice and solder balls, is attached to the metal alloy base. A series of lenses are positioned in the lens holder, which is situated on the image sensor dice. The flexible printed circuits (F.P.C.) feature solder joints that connect to the solder balls, facilitating the transmission of signals from the image sensor dice.

Career Highlights

Wen Kun Yang has worked with several prominent companies, including Advanced Chip Engineering Technology, Inc. and King Dragon International Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Wen Kun Yang has collaborated with notable colleagues, including Yu-Hsiang Yang and Wen Pin Yang. These partnerships have fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Wen Kun Yang's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the field. His innovative approaches continue to influence advancements in semiconductor devices and image sensor modules.

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