Hsien-Wen Hsu

Title: Hsien-Wen Hsu: Innovator in Semiconductor Technology

Introduction

Hsien-Wen Hsu is a prominent inventor based in Lujhou, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on innovative semiconductor device packaging solutions that enhance performance and reliability.

Latest Patents

Hsien-Wen Hsu's latest patents include groundbreaking inventions in semiconductor device packaging. One of his notable patents is for a semiconductor device package having a back side protective scheme. This invention provides a semiconductor device package that includes a die with a back surface and an active surface, an adhesive layer on the back surface, a protection substrate, and a plurality of bumps for electrical connection. The method for forming this package involves several steps, including providing multiple dies on a wafer, forming adhesive layers, and dicing the dies for individual use.

Another significant patent by Hsu is for a semiconductor device package featuring multi-chips with a side-by-side configuration. This invention comprises a substrate with die receiving through holes, connecting through holes structure, and contact pads on both the upper and lower surfaces. The design allows for the efficient placement of multiple dies, enhancing the overall functionality of the semiconductor package.

Career Highlights

Hsien-Wen Hsu is currently employed at Advanced Chip Engineering Technology, Inc., where he continues to innovate in semiconductor packaging technologies. His expertise and dedication