The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jun. 27, 2022
Dyi-chung HU, Hsinchu, TW;
Dyi-Chung Hu, Hsinchu, TW;
Abstract
A manufacturing method of a circuit carrier with a chip mounted thereon is provided. A fine redistribution structure is formed over a first temporary carrier. A first release layer is applied on the first temporary carrier. A plurality of conductive connectors is formed on the fine redistribution structure to form a first portion. The fine redistribution structure and the conductive connectors are transferred to a second temporary carrier. The second temporary carrier is provided with a second release layer. The first temporary carrier is removed after the conductive connectors inserted into the second release layer. A surface finishing process is performed on the fine conductive pattern distributed on the fine redistribution structure to form a surface finishing layer. The fine redistribution structure and the surface finishing layer formed thereon are adhered to a third temporary carrier through a third release layer. The first portion is disposed on a second portion.