The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Nov. 13, 2023
Applicant:
Dyi-chung HU, Hsinchu, TW;
Inventor:
Dyi-Chung Hu, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/105 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A manufacturing method of an integrated substrate structure is provided. The manufacturing method includes the following steps. A fine redistribution structure is formed over a temporary carrier. A plurality of first trenches is formed in the fine redistribution structure to form a plurality of fine redistribution segments. A coarse redistribution structure is coupled to the plurality of fine redistribution segments through a plurality of conductive connectors. A size of the coarse redistribution structure is greater than a size of the plurality of fine redistribution segments. The temporary carrier is removed from the plurality of fine redistribution segments after the coupling.