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For the Inventor, By the Inventor

Taoyuan, Taiwan

Tzyy-Jang Tseng

This inventor holds 95 USPTO granted patents and 29 published patent applications and 1 EPO patent, primarily in Circuit Board Structures (CPC class H01L23-49816). Top assignees: Unimicron Technology Corporation, Subtron Technology Co., Ltd., Industrial Technology Research Institute. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzyy-Jang Tseng. Retrieved from https://idiyas.com/inventor/tzyy-jang-tseng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 95 

% Patents Active = 88.4


Average Co-Inventor Count = 3.2

ph-index = 4

Forward Citations = 160(Granted Patents)

Forward Citations (Not Self Cited) = 134(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsinchu, TW (2009 - 2023)
  • Taoyuan, TW (2010 - 2024)

Company Filing History:

goldMedal92 out of 522 
 
Unimicron Technology Corporation
 patents
silverMedal3 out of 74 
 
Subtron Technology Co., Ltd.
 patents
bronzeMedal1 out of 9,308 
 
Industrial Technology Research Institute
 patents
where one patent can have more than one assignee

Years Active: 2009-2026

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Areas of Expertise:
Circuit Board Structure
Manufacturing Method
Package Structure
Light Emitting Diode
Optical Signal Transmitter
Probe Card Testing
Metal Bump Structure
Carrier Structure
Composite Substrate
Chip Package
Thermally Conductive Element
Inspection Apparatus
95 patents (USPTO):Explore Patents
1. 12727517 - Chip package structure and manufacturing method thereof (2026-09-01),
2. 12645041 - Package structure (2026-06-02),
3. 12625330 - Package structure and manufacturing method thereof (2026-05-12),
4. 12563667 - Manufacturing method of circuit board structure (2026-02-24),
5. 12412879 - Package structure and manufacturing method thereof (2025-09-09),
6. 12309943 - Circuit carrier and manufacturing method thereof and package structure (2025-05-20),
7. 12243838 - Circuit substrate structure and manufacturing method thereof (2025-03-04),
8. 11943877 - Circuit board structure and manufacturing method thereof (2024-03-26),
9. 11923350 - Light emitting diode package structure (2024-03-05),
10. 11860428 - Package structure and optical signal transmitter (2024-01-02),
11. 11837591 - Manufacturing method of light emitting diode package structure (2023-12-05),
12. 11808787 - Probe card testing device (2023-11-07),
13. 11764344 - Package structure and manufacturing method thereof (2023-09-19),
14. 11715715 - Metal bump structure and manufacturing method thereof and driving substrate (2023-08-01),
15. 11710690 - Package structure and manufacturing method thereof (2023-07-25),

Title: The Innovative Journey of Tzyy-Jang Tseng

Introduction: Tzyy-Jang Tseng, a pioneering inventor hailing from Taoyuan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Tseng's latest patents showcase his commitment to innovation, with a focus on advancements in renewable energy technologies and sustainable solutions for a greener future.

Career Highlights: Throughout his illustrious career, Tseng has been at the forefront of technological innovation, with a keen focus on developing cutting-edge solutions that have the potential to revolutionize industries.

Collaborations: Tseng has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His collaborative efforts have led to the development of groundbreaking technologies that have garnered international acclaim.

Conclusion: Tzyy-Jang Tseng's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his reputation as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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