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Cheng-Ta Ko

USPTO Granted Patents = 57 (Patent Applications = 26)

Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 58(Granted Patents)

Forward Citations (Not Self Cited) = 56(Dec 10, 2025)

Location History:

Hsinchu, TW (2011 - 2018)
Taoyuan, TW (2018 - 2022)
Taipei, TW (2011 - 2024)

Company Filing History:

Unimicron Technology Corporation

Industrial Technology Research Institute

National Yang Ming Chiao Tung University

Years Active: 2011-2025

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Areas of Expertise:

Chip Packaging

Circuit Board Structure

Flexible Circuit Board

Light Emitting Diode Package

Vapor Chamber Device

Touch-Sensing Display Panel

Miniaturized Particulate Matter Detector

Bonding Structure

Circuit Redistribution Structure

Substrate Structure

Electronic Device Bonding

Manufacturing Methods

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12504591 - Co-packaged structure for optics and electrics (2025-12-23),

2. 12438060 - Chip package and method of manufacturing the same (2025-10-07),

3. 12414243 - Manufacturing method of package structure (2025-09-09),

4. 12369250 - Circuit board structure and manufacturing method thereof (2025-07-22),

5. 12309943 - Circuit carrier and manufacturing method thereof and package structure (2025-05-20),

6. 12250776 - Substrate structure and cutting method thereof (2025-03-11),

7. 12243838 - Circuit substrate structure and manufacturing method thereof (2025-03-04),

8. 12185479 - Flexible circuit board and manufacturing method thereof (2024-12-31),

9. 12160953 - Circuit board structure and manufacturing method thereof (2024-12-03),

10. 12062742 - Package structure and manufacturing method of the same (2024-08-13),

11. 11991824 - Circuit board structure and manufacturing method thereof (2024-05-21),

12. 11955587 - Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device (2024-04-09),

13. 11943877 - Circuit board structure and manufacturing method thereof (2024-03-26),

14. 11895780 - Manufacturing method of package structure (2024-02-06),

15. 11764344 - Package structure and manufacturing method thereof (2023-09-19),

Title: Cheng-Ta Ko: Innovator from Taipei

Introduction: Cheng-Ta Ko is a renowned inventor hailing from Taipei, Taiwan, known for his groundbreaking contributions to various fields.

Latest Patents: Cheng-Ta Ko holds several patents in the areas of technology and healthcare, showcasing his innovative mindset and problem-solving abilities.

Career Highlights: Throughout his career, Cheng-Ta Ko has worked on numerous projects that have revolutionized the way we approach challenges in the modern world. His dedication to innovation has led to the development of cutting-edge solutions that have had a significant impact on society.

Collaborations: Cheng-Ta Ko has collaborated with leading experts in the industry, including researchers, engineers, and scientists, to bring his ideas to life. These collaborations have resulted in the creation of unique and impactful inventions that have shaped the landscape of innovation.

Conclusion: Cheng-Ta Ko's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His contributions continue to inspire future generations to push the boundaries of what is possible.

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