The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
May. 15, 2023
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Jeng-Ting Li, Taoyuan, TW;
Chi-Hai Kuo, Taoyuan, TW;
Cheng-Ta Ko, Taoyuan, TW;
Pu-Ju Lin, Taoyuan, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); C03C 15/00 (2006.01); C03C 23/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/002 (2013.01); C03C 15/00 (2013.01); C03C 23/0025 (2013.01); H05K 1/0306 (2013.01); H05K 2203/107 (2013.01);
Abstract
A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate to form a modified region on the glass substrate. A wet etching process is performed on the modified region of the glass substrate to remove the modified region and form a plurality of second substrate structures.