Company Filing History:
Years Active: 2022-2026
Title: Chi-Hai Kuo: Innovator in Substrate Structures and Flexible Circuit Boards
Introduction
Chi-Hai Kuo is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of substrate structures and flexible circuit boards. With a total of 13 patents to his name, Kuo continues to push the boundaries of innovation in his industry.
Latest Patents
Kuo's latest patents include a substrate structure and a cutting method thereof. This invention provides a cutting method that involves several steps, including the provision of a first substrate structure that consists of a glass substrate and a redistribution layer. A laser process is performed on the glass substrate to create a modified region, followed by a wet etching process to remove this region and form multiple second substrate structures. Another notable patent is for a flexible circuit board and its manufacturing method. This flexible circuit board features a circuit structure with multiple circuit and insulating layers, where the insulating layers are made from a photosensitive dielectric material with a Young's modulus ranging from 0.36 GPa to 8 GPa.
Career Highlights
Chi-Hai Kuo is currently employed at Unimicron Technology Corporation, where he applies his expertise in electronics and materials science. His work has been instrumental in advancing the technology behind flexible circuit boards and substrate structures, making significant impacts in the electronics industry.
Collaborations
Kuo has collaborated with notable colleagues such as Pu-Ju Lin and Cheng-Ta Ko. These partnerships have fostered innovation and have contributed to the successful development of his patented technologies.
Conclusion
Chi-Hai Kuo is a distinguished inventor whose work in substrate structures and flexible circuit boards has greatly influenced the electronics field. His innovative patents and collaborations highlight his commitment to advancing technology and improving electronic components.