Pingtung County, Taiwan

Jeng-Ting Li

USPTO Granted Patents = 5 

Average Co-Inventor Count = 4.8

ph-index = 1


Company Filing History:


Years Active: 2024-2025

Loading Chart...
5 patents (USPTO):

Title: Jeng-Ting Li: Innovator in Chip Packaging Technology

Introduction

Jeng-Ting Li is a prominent inventor based in Pingtung County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 5 patents. His work focuses on innovative methods and structures that enhance the performance and reliability of electronic components.

Latest Patents

Among his latest patents, Jeng-Ting Li has developed a chip package and a method of manufacturing the same. This chip package features a redistribution layer, a chip, and an encapsulation member. The redistribution layer consists of an insulation part, multiple first pads, and second pads, with the chip being electrically connected to the first pads. The encapsulation member wraps around the chip and the redistribution layer, ensuring that the second pads remain exposed.

Another notable patent is related to a substrate structure and a cutting method thereof. This innovation involves a glass substrate with a redistribution layer, where a laser process is utilized to create a modified region on the glass substrate. Following this, a wet etching process removes the modified region, resulting in multiple second substrate structures.

Career Highlights

Jeng-Ting Li is currently employed at Unimicron Technology Corporation, where he continues to push the boundaries of technology in chip packaging. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Throughout his career, Jeng-Ting Li has collaborated with talented individuals such as Cheng-Ta Ko and Pu-Ju Lin. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Jeng-Ting Li's contributions to chip packaging technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic component design and manufacturing.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…