The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Nov. 04, 2021
Unimicron Technology Corp., Taoyuan, TW;
Cheng-Hui Wu, New Taipei, TW;
Jeng-Ting Li, Pingtung County, TW;
Ping-Tsung Lin, Miaoli County, TW;
Kai-Ming Yang, Hsinchu County, TW;
Pu-Ju Lin, Hsinchu, TW;
Cheng-Ta Ko, Taipei, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A chip package includes a redistribution layer, a chip, and an encapsulation member. The redistribution layer includes an insulation part, a plurality of first pads and a plurality of second pads, where the insulation part has a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface. The first pads and the second pads are located at the first surface and the second surface respectively. The chip is disposed on the first surface and electrically connected to the first pads. The encapsulation member wraps the chip and the redistribution layer, and covers the first surface and the side surface, where the encapsulation member exposes the second pads, and the encapsulation member is not flush with the first surface and the side surface.