Ping-Tsung Lin

Title: Innovations of Ping-Tsung Lin in Chip Packaging and Circuit Board Technology.

Introduction

Ping-Tsung Lin is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the fields of chip packaging and circuit board technology. With a total of 2 patents, his work has advanced the efficiency and functionality of electronic components.

Latest Patents

One of his latest patents is titled "Chip package and method of manufacturing the same." This invention describes a chip package that includes a redistribution layer, a chip, and an encapsulation member. The redistribution layer features an insulation part with a first surface, a second surface, and a side surface. The chip is positioned on the first surface and is electrically connected to the first pads, while the encapsulation member wraps around the chip and the redistribution layer, exposing the second pads.

Another significant patent is "Circuit board structure and manufacturing method thereof." This patent outlines a circuit board structure that consists of a carrier, a thin film redistribution layer, solder balls, and a surface treatment layer. The thin film redistribution layer includes multiple pads and dielectric layers, with solder balls electrically connected to the second metal layer and the carrier. This innovative design enhances the performance and reliability of circuit boards.

Career Highlights

Ping-Tsung Lin is currently employed at Unimicron Technology Corporation, where he continues to develop cutting-edge technologies in the electronics sector. His work has been instrumental in improving the design and manufacturing processes of electronic components.

Collaborations

He has collaborated with notable coworkers such as Kai-Ming Yang and Pu-Ju Lin, contributing to various projects that push the boundaries of technology in their field.

Conclusion

Ping-Tsung Lin's contributions to chip packaging and circuit board technology exemplify his innovative spirit and dedication to advancing electronic engineering. His patents reflect a commitment to enhancing the functionality and efficiency of electronic devices.