The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
May. 20, 2024
Unimicron Technology Corp., Taoyuan, TW;
Tzyy-Jang Tseng, Taoyuan City, TW;
Cheng-Ta Ko, Taipei City, TW;
Pu-Ju Lin, Hsinchu City, TW;
Chi-Hai Kuo, Taoyuan City, TW;
Shao-Chien Lee, Taoyuan City, TW;
Ming-Ru Chen, Hsinchu City, TW;
Cheng-Chung Lo, Hsinchu County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A manufacturing method of a circuit board structure includes the following steps. A first sub-circuit board having an upper surface and a lower surface opposite to each other and including at least one conductive through hole is provided. A second sub-circuit board including at least one conductive through hole is provided on the upper surface of the first sub-circuit board. A third sub-circuit board including at least one conductive through hole is provided on the lower surface of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are laminated so that at least two of their conductive through holes are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are electrically connected to one another.