The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Jun. 22, 2023
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Chin-Sheng Wang, Taoyuan, TW;

Kai-Ming Yang, Taoyuan, TW;

Chen-Hao Lin, Taoyuan, TW;

Pu-Ju Lin, Taoyuan, TW;

Cheng-Ta Ko, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4293 (2013.01); G02B 6/424 (2013.01); G02B 6/4244 (2013.01); G02B 6/4259 (2013.01);
Abstract

A co-packaged structure for optics and electrics includes a substrate, an optical module and an electrical connection layer. The optical module includes a carrier and an optical transceiver unit. The carrier is mounted on the substrate. The optical module is mounted on the carrier. The electrical connection layer is mounted on the substrate, and the carrier is electrically connected with a circuitry on the substrate through the electrical connection layer. A plurality of fiber accommodation through hole are formed on the substrate and correspond to the optical transceiver unit.


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