The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
May. 30, 2024
Unimicron Technology Corp., Taoyuan City, TW;
Chin-Sheng Wang, Taoyuan City, TW;
Ra-Min Tain, Hsinchu County, TW;
PO-Wen Hsiao, Taoyuan City, TW;
Cheng-Ta Ko, Taipei City, TW;
Shih-Lian Cheng, New Taipei City, TW;
Guang-Hwa MA, Hsinchu City, TW;
Unimicron Technology Corp., Taoyuan City, TW;
Abstract
A substrate structure includes a first substrate and a second substrate. The first substrate includes a first glass plate and at least one first conductive via penetrating the first glass plate. The second substrate includes a second glass plate and at least one second conductive via penetrating the second glass plate. The second substrate is connected to the first substrate. The second glass plate is bonded to the first glass plate through chemical bonding force and defines a chemical bonding contact surface with the first glass substrate. The at least one second conductive via is bonded to the at least one first conductive via through metal diffusion and defines at least one metal bonding contact surface with the at least one first conductive via.