For the Inventor, By the Inventor

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Hsinchu County, Taiwan

Subtron Technology Co., Ltd.

USPTO Granted Patents = 74

EPO Patents = 3

Forward Citations = 81

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31 inventors (with patents filed for the assignee):

Shih-Hao Sun (23 out of 23 patents)

Chin-Sheng Wang (11 out of 23 patents)

Chao-Min Wang (9 out of 11 patents)

4. Ching-Sheng Chen (8 out of 17 patents)

5. Chien-Ming Chen (7 out of 7 patents)

6. Tzu-Shih Shen (6 out of 6 patents)

7. Chih-Hong Chuang (6 out of 6 patents)

8. Chien-Hung Wu (5 out of 5 patents)

9. Tzu-Wei Huang (5 out of 13 patents)

10. Chung W Ho (4 out of 16 patents)

11. Tzyy-Jang Tseng (3 out of 91 patents)

12. Chih-Hsien Cheng (3 out of 3 patents)

13. Shih-Lian Cheng (3 out of 3 patents)

14. Chang-Fu Chen (2 out of 2 patents)

15. Leo Shen (2 out of 2 patents)

Core Competencies:

Waveguide Structure

Heat Dissipation Substrate

Package Carrier

Circuit Board

Substrate Structure

Illumination Apparatus

Multi-Layer Circuit Board

Electronic Structure

Cover Structure

Manufacturing Method

Embedded Package Carrier

Circuit Structure

74 patents: Sort by Forward Citations

1. 11764451 - Waveguide structure (2023-09-19),

2. 11171072 - Heat dissipation substrate and manufacturing method thereof (2021-11-09),

3. 10957614 - Heat dissipation substrate and fabricating method thereof (2021-03-23),

4. 10798822 - Method of manufacturing a component embedded package carrier (2020-10-06),

5. 10319610 - Package carrier (2019-06-11),

6. 10297517 - Manufacturing method of package carrier (2019-05-21),

7. 10177067 - Manufacturing method of package carrier (2019-01-08),

8. 10123413 - Package substrate and manufacturing method thereof (2018-11-06),

9. 9961784 - Manufacturing method of circuit substrate (2018-05-01),

10. 9933149 - Illumination apparatus (2018-04-03),

11. 9883599 - Manufacturing method for multi-layer circuit board having cavity (2018-01-30),

12. 9883594 - Substrate structure for packaging chip (2018-01-30),

13. 9870931 - Package carrier and manufacturing method thereof (2018-01-16),

14. 9761515 - Substrate structure (2017-09-12),

15. 9693468 - Package substrate and manufacturing method thereof (2017-06-27),

Subtron Technology Co., Ltd. is a leading global provider of innovative technology solutions. With expertise in electronic components, our company offers a comprehensive range of products and services designed to meet the needs of various industries. Subtron Technology focuses on delivering high-quality solutions through continuous research and development, ensuring customer satisfaction and success. Visit our website to learn more about our cutting-edge products and industry-leading services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

74 Patents

#7 in Hsinchu County

#295 in Taiwan

#9,846 in the World

Hsinchu County, Taiwan

Subtron Technology Co., Ltd.

Forward Citations = 81

31 inventors:

Shih-Hao Sun (23 out of 23 patents)

Chin-Sheng Wang (11 out of 23 patents)

Chao-Min Wang (9 out of 11 patents)

4. Ching-Sheng Chen (8 out of 17 patents)

5. Chien-Ming Chen (7 out of 7 patents)

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