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Hsinchu, Taiwan

Subtron Technology Co., Ltd.

USPTO Granted Patents = 74

% Expired Patents = 41.9

EPO Patents = 3

Forward Citations = 83

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31 inventors (with patents filed for the assignee):

Shih-Hao Sun (23 out of 23 patents)

Chin-Sheng Wang (11 out of 30 patents)

Chao-Min Wang (9 out of 11 patents)

4. Ching-Sheng Chen (8 out of 18 patents)

5. Chien-Ming Chen (7 out of 7 patents)

6. Tzu-Shih Shen (6 out of 6 patents)

7. Chih-Hong Chuang (6 out of 6 patents)

8. Chien-Hung Wu (5 out of 5 patents)

9. Tzu-Wei Huang (5 out of 13 patents)

10. Chung W Ho (4 out of 16 patents)

11. Tzyy-Jang Tseng (3 out of 95 patents)

12. Chih-Hsien Cheng (3 out of 3 patents)

13. Shih-Lian Cheng (3 out of 3 patents)

14. Chang-Fu Chen (2 out of 2 patents)

15. Leo Shen (2 out of 2 patents)

Core Competencies:

Waveguide Structure

Heat Dissipation Substrate

Package Carrier

Manufacturing Method

Circuit Board

Substrate Structure

Semiconductor Package

Illumination Apparatus

Multi-layer Circuit Board

Thermal Enhanced Substrate

Embedded Passive Component

Cover Structure

74 patents: Sort by Forward Citations

1. 11764451 - Waveguide structure (2023-09-19),

2. 11171072 - Heat dissipation substrate and manufacturing method thereof (2021-11-09),

3. 10957614 - Heat dissipation substrate and fabricating method thereof (2021-03-23),

4. 10798822 - Method of manufacturing a component embedded package carrier (2020-10-06),

5. 10319610 - Package carrier (2019-06-11),

6. 10297517 - Manufacturing method of package carrier (2019-05-21),

7. 10177067 - Manufacturing method of package carrier (2019-01-08),

8. 10123413 - Package substrate and manufacturing method thereof (2018-11-06),

9. 9961784 - Manufacturing method of circuit substrate (2018-05-01),

10. 9933149 - Illumination apparatus (2018-04-03),

11. 9883599 - Manufacturing method for multi-layer circuit board having cavity (2018-01-30),

12. 9883594 - Substrate structure for packaging chip (2018-01-30),

13. 9870931 - Package carrier and manufacturing method thereof (2018-01-16),

14. 9761515 - Substrate structure (2017-09-12),

15. 9693468 - Package substrate and manufacturing method thereof (2017-06-27),

Company Overview

Subtron Technology Co., Ltd., based in Hsinchu, Taiwan, specializes in the development and manufacturing of advanced heat dissipation substrates. The company focuses on innovative technologies such as waveguide structures and semiconductor packaging solutions, catering to the needs of various industries including electronics and illumination. With a commitment to enhancing thermal management and substrate performance, Subtron plays a pivotal role in the evolution of circuit board technology and related manufacturing methods.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

74 Patents

#79 in Hsinchu

#299 in Taiwan

#10,131 in the World

Hsinchu, Taiwan

Subtron Technology Co., Ltd.

Forward Citations = 83

31 inventors:

Shih-Hao Sun (23 out of 23 patents)

Chin-Sheng Wang (11 out of 30 patents)

Chao-Min Wang (9 out of 11 patents)

4. Ching-Sheng Chen (8 out of 18 patents)

5. Chien-Ming Chen (7 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Subtron Technology Co., Ltd.. Retrieved from https://idiyas.com/company/subtron-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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