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For the Inventor, By the Inventor

Taipei, Taiwan

Chung W Ho

This inventor holds 16 USPTO granted patents and 3 published patent applications, primarily in Chip Packaging Technology. Top assignees: Subtron Technology Co., Ltd., Unimicron Technology Corporation, Thin Film Module, Inc.. Active years: 2001-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung W Ho. Retrieved from https://idiyas.com/inventor/chung-w-ho-epu2jxv0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 68.8

Average Co-Inventor Count = 1.4

ph-index = 4

Forward Citations = 72(Granted Patents)


Location History:

  • Hsinchu, TW (2001 - 2003)
  • Taoyuan, TW (2016)
  • Taipei, TW (2004 - 2022)

Company Filing History:

goldMedal4 out of 74 
 
Subtron Technology Co., Ltd.
 patents
silverMedal4 out of 523 
 
Unimicron Technology Corporation
 patents
bronzeMedal3 out of 13 
 
Thin Film Module, Inc.
 patents
4. 5 out of 834,601 
Other
 patents

Years Active: 2001-2022

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Areas of Expertise:
Chip Carrier
Chip Package
Circuit Board
Circuit Substrate
Coreless Packaging
High Thermal Conducting
Printed Wiring Board
Flip Chip BGA
Cavity-Up BGA
Electronic Structure
Substrate Core
16 patents (USPTO):Explore Patents
1. 11227824 - Chip carrier and manufacturing method thereof (2022-01-18),
2. 11217551 - Chip package structure and manufacturing method thereof (2022-01-04),
3. 11189501 - Chip package structure and manufacturing method thereof (2021-11-30),
4. 11178774 - Method for manufacturing circuit board (2021-11-16),
5. 10201099 - Manufacturing method of circuit substrate including electronic device (2019-02-05),
6. 9485863 - Carrier and method for fabricating coreless packaging substrate (2016-11-01),
7. 9137899 - Process of electronic structure and electronic structure (2015-09-15),
8. 8939188 - Edge separation equipment and operating method thereof (2015-01-27),
9. 7867908 - Method of fabricating substrate (2011-01-11),
10. 7642571 - Substrate core (2010-01-05),
11. 7540969 - High thermal conducting circuit substrate and manufacturing process thereof (2009-06-02),
12. 7535098 - Structure of substrate (2009-05-19),
13. 7223687 - Printed wiring board and method of fabricating the same (2007-05-29),
14. 6753600 - Structure of a substrate for a high density semiconductor package (2004-06-22),
15. 6562656 - Cavity down flip chip BGA (2003-05-13),

Title: The Innovative Journey of Inventor Chung W Ho

Introduction: Chung W Ho, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Chung W Ho's latest patents showcase his commitment to innovation and include advancements in renewable energy technologies, artificial intelligence systems, and sustainable materials.

Career Highlights: Throughout his illustrious career, Chung W Ho has been at the forefront of technological advancements, leading research teams and spearheading projects that have revolutionized various industries. His expertise in patent law has also enabled him to protect his inventions effectively.

Collaborations: Chung W Ho has collaborated with leading research institutions, universities, and tech companies worldwide to further his innovative projects. His ability to work in multidisciplinary teams has resulted in the development of cutting-edge technologies that have had a lasting impact.

Conclusion: Chung W Ho's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a visionary inventor. His contributions to the world of technology continue to inspire future generations of inventors and researchers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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