The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Apr. 13, 2009
Tzyy-jang Tseng, Hsinchu, TW;
Chih-ming Chang, Tainan, TW;
Cheng-po Yu, Taoyuan County, TW;
Chung W. Ho, Taipei, TW;
Tzyy-Jang Tseng, Hsinchu, TW;
Chih-Ming Chang, Tainan, TW;
Cheng-Po Yu, Taoyuan County, TW;
Chung W. Ho, Taipei, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A method of fabricating a substrate includes following steps. First, a metallic panel having a first surface and a second surface is provided. A first half-etching process is carried out to etch the first surface of the metallic panel to a first depth so that a first patterned metallic layer is formed on the first surface. Next, a first insulating material is deposited into gaps in the first patterned metallic layer to form a first insulator. Thereafter, a second half-etching process is carried out to etch the second surface of the metallic panel to a second depth and expose at least a portion of the first insulator so that a second patterned metallic layer is formed on the second surface. The first depth and the second depth together equal the thickness of the metallic panel.